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会议信息
2018 International Conference on Physics, Computing and Mathematical Modeling
April 15-16, 2018, Shanghai, China
Website: http://www.pcmm2018.org/
2018年物理,计算和数学建模国际学术会议 (PCMM2018)
2018年4月15-16日中国上海举行
中文官网:http://www.pcmm2018.org/index_cn.html
[About PCMM2018]
Welcome to 2018 International Conference on Physics, Computing and Mathematical Modeling (PCMM2018), which will be held on April 15-16, 2018, Shanghai, China. This Conference will cover issues on Physics, Computing and Mathematical Modeling. It dedicates to creating a stage for exchanging the latest research results and sharing the advanced research methods. PCMM2018 will be a valuable and important platform for inspiring international and interdisciplinary exchange at the forefront of Physics, Computing and Mathematical Modeling. The Conference will bring together academicians, scientists, engineers, and technicians from all over the world, and we hope that you will take this opportunity to join us for academic exchange and visit the city of Shanghai.
[Publication]

All the PCMM2018 accepted papers will be published in the Journal?DEStech Transactions on Engineering and Technology Research with ISSN: 2475-885X, ISBN and DOI for all papers. The press will submit all papers to be indexed in EI Compendex (Elsevier Engineering Village Index), Scopus Thomson Reuters Conference Proceedings Citation Index (ISI), INSPEC, DBLP and CNKI Scholar online available in full text via the press platform. Excellent papers will be selected and published on SCI and EI journals.

PCMM2018所有审核被录用的文章都将出版在《DEStech Transactions on Engineering and Technology Research, ISSN: 2475-885X》学术期刊上。出版完成后,所有文章将统一由出版社提交至?EI Compendex (Elsevier Engineering Village Index), Scopus Thomson Reuters Conference Proceedings Citation Index (ISI), INSPEC, DBLP and CNKI Scholar进行检索,被选中的优秀论文将刊发在EI或者SCI期刊上。

[Paper Submission]
Download the Paper Format: Template
Download the Submission Form: Submission Form
Please send your Paper(s) and Submission Form to PCMM2018 via email:
submit@pcmm2018.org and pcmm2018@sina.com. The email subject please named "Submission".
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