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General Information

第三届材料工艺技术国际研讨会(MPT 2018)
The 3rd Int'l Conference on Materials Processing Technology (MPT 2018)
大会官网:http://www.encconf.org/conference/MPT2018/
大会时间:2018年7月14-16日
大会地点:中国昆明
主办单位:工程信息研究院、千人智库、科研出版社
注册投稿:http://www.encconf.org/RegistrationSubmission/default.aspx?ConferenceID=1007
摘要全文截稿时间:详情查看官网
接收/拒稿通知:论文投稿后一周左右

演讲嘉宾

  • Prof. Arup Kumar Raychaudhuri, S.N.Bose National Centre for Basic Sciences, India
  • Prof. Roberto Contro, Technical University of Milan, Italy
  • Dr. Saiful Amri Mazlan, Universiti Teknologi Malaysia, Malaysia
  • Prof. Da-Ming Zhu, University of Missouri-Kansas City, USA
  • Dr. D. SENTHILKUMAR M.E., P.A.College of Engineering and Technology, India
  • Prof. Olivier Bonnaud, University of Rennes, France

    文章出版

    所有被会议录用的英文稿件将会发表在科研出版社的开源期刊 "Journal of Materials Science and Chemical Engineering" (ISSN: 2327-6045), 详情请点击:http://www.scirp.org/journal/msce/.

    如果您只是参会作报告,不需要发表文章,您只需要将您的摘要提交到投稿系统

    参会价格

    Package A: 仅参会(无报告) USD 400 (RMB 2400)
    Package B: 参会 + 摘要报告 USD 450 (RMB 2700)
    Package C: 参会 + 全文发表 + 报告 USD 600 (RMB 3600)

    参会费包含内容:
    1. 可参加所有会场
    2. 会议期间午餐(7月15,16日)
    3. 会议期间晚餐(7月15日晚)
    4. 会议期间茶歇
    5. 会议指南及会议期刊各一本

    联系方式

    联系人:孔老师
    邮箱: material_july@engii.org
    电话: +86 132 6470 2250
    QQ: 3025797047
    微信:Engii_hw

    会议议题

    该会议征文涉及领域包括(但不限于):
    Materials Casting
    Materials Forming
    Materials Machining
    Surface Engineering / Coatings
    Welding and Joining
    Laser Processing Technology
    Microwave Processing of Materials
    Processing Technology for Functional Materials
    Advanced Composite and Hybrid Processes
    Modeling and Simulation of Manufacturing Processes
    Low Cost Packaging
    Design and Behavior of Equipments and Tool s
    Evolution of Material Properties
    Material Design of Computer Aided
    Function Test and Evaluation Technology
    Green Manufacturing and Processing
    Other Related Topics

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